![]() The crimp contacts and headers are tray-packed inside of cartons. The receptacle housings and their TPA retainers are bag-packed into cartons. ![]() How are the PowerWize BMI components packaged? For the 6.00mm PowerWize BMI solution, the mated height is 22.10mm, while for the 8.00mm PowerWize BMI solution, the mated height is 24.10mm. The nominal mated height of the 3.40mm PowerWize BMI solution is 17.45mm. What is the mated height of the PowerWize BMI solution? My design has unique space constraints that limit the height that the receptacle assembly can extend above the surface of my printed circuit board (or busbar). PowerWize BMI crimp machined contacts wide range and will accept 1/0, 2, 4, 6, 8, or 10 AWG wires. PowerWize BMI screw-mount headers can attach to either printed circuit boards or busbars and PowerWize BMI solder tail headers attach to printed circuit boards. Identifying high-power wire-to-board/busbar interconnects that can be attached to a wide range of substrates and crimped to a wide range of wire gauges. ![]() Guide rails engage before the electrical components to help ensure gross alignment and the panel mount housing flanges allow +/- 2.0mm of radial self-alignment to mitigate tolerance stack-up issues. PowerWize BMI connectors are designed for blind-mating situations. The voltage drop across the contact interface is very low with minimal heat generation.ĭense electronic packaging often requires designs where subassemblies are mated without visual guidance, such as drawer style applications. PowerWize BMI connectors incorporate Molex’s proven COEUR socket, which has multiple contact beams to create a large contact surface at the contact interface, resulting in very low contact resistance. Power efficiency is critical to cost and safety management in power intensive applications, such as power transmission systems in datacenters, base stations, battery management, inverters, etc. ![]()
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